MJ CH3 Phone Motherboard Layer Welding Platfrom Phone Motherboard Preheater for iPhone X Xs Xsmax
Product Introduciton:
-3 In 1 universal iPhone X/XS/XSMAX, support A11 A12 CPU chip, A11 A12 HHD, iPhoneX Baseband, iPhoneXS/XSMAX baseband and glue removal.
-Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
-Size: 185*54*29mm (Main Unit) ;Size: 160*88*48mm (Thermostat)
-Voltage: 100-250V
Package list:
-Main Unit *1
-Thermostat *1
-Power cable *1
-Connect cable *1
Please be aware that due to your computer monitor display the color may have some difference between the picture and the physical item
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